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SD103ASDM
Document number: DS30294 Rev. 9 - 2
1 of 3
www.diodes.com
July 2008
? Diodes Incorporated
SD103ASDM
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Features
?
Low Forward Voltage Drop
?
Guard Ring Construction for Transient Protection
?
Fast Switching
?
Low Reverse Capacitance
?
Lead Free/RoHS Compliant (Note 3)
?
"Green" Device, (Note 4 and 5)
Mechanical Data
?
Case: SOT-26
?
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Polarity: See Diagram
?
Leads: Solderable per MIL-STD-202, Method 208
?
Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
?
Marking Information: See Page 2
?
Ordering Information: See Page 2
?
Weight: 0.016 grams (approximate)
Top View
Device Schematic
Maximum Ratings
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40
V
RMS Reverse Voltage
VR(RMS)
28
V
Forward Continuous Current (Note 1)
IFM
350
mA
Non-Repetitive Peak Forward Surge Current @ t ≤
1.0s
IFSM
1.5
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
225
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
RθJA
444
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +125
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V(BR)R
40
?
?
V
IR
= 100
μA
Forward Voltage Drop
VF
?
?
0.37
0.50
0.60
V
IF = 20mA
IF = 100mA
IF = 200mA
Reverse Current (Note 2)
IR
?
?
5.0
μA
VR
= 30V
Total Capacitance
CT
?
50
?
pF
VR
= 0V, f = 1.0MHz
Reverse Recovery Time
trr
?
10
?
ns
IF
= I
R
= 200mA,
Irr = 0.1 x IR, RL
= 100
Ω
Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes
Inc. suggested pad layout AP02
001, which can be found on our
website at http://www
.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can
be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date C
ode 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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